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Panacol has developed a new range of high-performance adhesives for frame-and-fill applications on printed circuit boards. 
Panacol 開發了一系列新的高性能粘合劑，用於印刷電路板上的框架和填充應用。

Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards. In the first step, a highly viscous barrier – the so-called frame – is applied. In the next step, this area is quickly filled with lower viscosity filler material – the fill. With this precise process, areas on the circuit board can be protected from mechanical impact factors.The combination of frame-and-fill materials allows the application of minimum barrier and potting heights and cures to a homogeneous coating. Panacol's new frame-and-fill adhesives are perfectly matched so that the frame and fill areas can be optimally dispensed wet-on-wet without the still-liquid adhesives leading to undesired flowing on the PCB.
框架和填充工藝用於保護電子電路板上高度複雜的區域。第一步，應用高粘性屏障——所謂的框架——。在下一步中，該區域會快速填充粘度較低的填充材料 - 填充物。通過這種精確的工藝，可以保護電路板上的區域免受機械影響因素的影響。框架和填充材料的組合允許應用最小的阻隔和灌封高度，並固化成均勻的塗層。 Panacol 的新型框架和填充粘合劑完美匹配，因此框架和填充區域可以濕對濕進行最佳分配，而不會導致在 PCB 上流動的仍為液體的粘合劑。

The frame material, Structalit^® 5704, is a black, thermally curable and single-component epoxy. This frame and glob top compound features excellent bead stability and high glass transition temperature of 150°C up to 190°C, depending on the curing parameters and the layer thicknesses. When using Structalit^® 5704, no bleeding effects occur. Due to the very low ion content of less than 20 ppm, Structalit^® 5704 is suitable for chip encapsulation on electronic circuit boards. 
框架材料 Structalit® 5704 是一種黑色、可熱固化的單組分環氧樹脂。這種框架和球頂複合物具有出色的珠粒穩定性和 150°C 至 190°C 的高玻璃化轉變溫度，具體取決於固化參數和層厚度。使用 Structalit® 5704 時，不會發生滲色效應。由於低於 20 ppm 的極低離子含量，Structalit® 5704 適用於電子電路板上的芯片封裝。

As a fill material, Panacol has developed a range of adhesives with different rheological properties. The adhesives Structalit^® 5717 to Structalit^® 5721 are formulated with optimized flow behavior, so that the adhesives can be used on various chip and bonding wire geometries due to the differently adjusted viscosities. Since the fills have the same chemical base as the frame material, the excellent physical and chemical properties of high glass transition range, ion purity, temperature stability and minimal shrinkage behavior are also found in the fillls.
作為填充材料，Panacol 開發了一系列具有不同流變特性的粘合劑。 Structalit® 5717 至 Structalit® 5721 粘合劑的配方具有優化的流動特性，因此由於粘度調整的不同，粘合劑可用於各種芯片和鍵合線幾何形狀。由於填充物與框架材料具有相同的化學基礎，因此填充物還具有高玻璃化轉變範圍、離子純度、溫度穩定性和最小收縮行為等優異的物理和化學特性。

 

資料來源：https://www.panacol.com/press/press-releases
　　　　　https://www.panacol.com/adhesive-applications/pcb/frame-and-fill