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Panacol has developed a new reworkable underfill for consumer electronics. The reworkability and fluorescence despite its black color of the new Structalit^® 5751 adhesive allows manufacturers to reduce both manufacturing costs and environmental impact by reusing electronic components mounted on PCBs.
Panacol 開發了一種用於消費電子產品的新型可返工底部填充膠。儘管新型 Structalit® 5751 黏合劑為黑色，但其可再加工性和瑩光性使製造商能夠通過重複使用安裝在 PCB 上的電子元件來降低製造成本和對環境的影響。
 
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences.
底部填充用於平衡晶片和基板之間的應力。晶片直接連接到互連點，無需中間元件。由於基板的熱膨脹係數不同，當電子零件在操作過程中被加熱和冷卻時，焊點處會產生應力。底部填充技術的開發是為了抵消這些機械影響。

Structalit^® 5751 is a black, heat-curing, resin-based epoxy adhesive characterized by its low viscosity and linear flow behavior. These properties enable precise application. In addition to classic contact dispensing by means of a dispenser, the uncured properties of Structalit^® 5751 also allow contactless dispensing for fast and precise placement of the adhesive. This underfill is has a low ion content and is ideally suited for electronic component packaging.
Structalit® 5751 是一種黑色、熱固化、樹脂基環氧黏合劑，其特點是低黏度和線性流動行為。這些特性可實現精確應用。除了通過點膠機進行經典的接觸式點膠外，Structalit® 5751 的未固化特性還允許進行非接觸式點膠，以快速準確地放置黏合劑。這種底部填充膠離子含量低，非常適合電子元件封裝。

A typical feature of adhesives on PCBs is their black coloring, which is used to obscure proprietary features and for optical inspection. Optical measurement of an underfill is a common method used in the manufacturing process by manufacturers. But due to the dark chip, shallow layer thickness of the black adhesive and tight gap between the chip and the substrate, optical measurement is often difficult. Panacol has addressed this problem by incorporating an additional yellow shimmering fluorescence to the black coloration of Structalit^® 5751. It can be stimulated by short wavelength light of <365nm. This makes it even easier for manufacturers to perform final inspections and speeds up production processes.
PCB 上黏合劑的一個典型特徵是它們的黑色，用於掩蓋專有特徵和進行光學檢查。底部填充膠的光學測量是製造商在製造過程中使用的常用方法。但由於晶片顏色較深，黑色膠層厚度較淺，晶片與基板之間的間隙過小，光學測量往往比較困難。 Panacol 通過在 Structalit® 5751 的黑色著色中加入額外的黃色閃爍瑩光來解決這個問題。它可以被 <365nm 的短波長光激發。這使製造商更容易執行最終檢查並加快生產過程。
 

In addition to the performance and optical inspection capability of Structalit^® 5751, Panacol offers another important property with its newly developed underfill: reworkability. This provides the ability to re-process or repair products after assembly. For manufacturers of electronic components, this challenge is becoming increasingly important as legislation and environmental associations push for the minimization of electronic waste. One starting point of this sustainable strategy is the reworkability and repairability of individual modules on printed circuit boards to counteract the scrapping of a complete component or module.
除了 Structalit® 5751 的性能和光學檢測能力之外，Panacol 還通過其新開發的底部填充膠提供了另一個重要特性：可再加工性。這提供了在組裝後重新處理或修復產品的能力。對於電子元件製造商而言，隨著立法和環境協會推動電子廢物最小化，這一挑戰變得越來越重要。這種可持續戰略的一個起點是印刷電路板上單個零件的可返工性和可修復性，以抵消整個組件或模組的報廢。

Structalit^® 5751 can be strategically softened at specific adhesion points by applying temperatures above its glass transition temperature range of 150°C. The product becomes reworkable only when this critical temperature threshold is reached.  The reworkability temperature does not reduce the protective function of the Structalit^® 5751 during typical PCB processing.  It withstands temperatures associated with reflow soldering and additional thermal curing cycles.
Structalit® 5751 可以通過施加高於其 150°C 玻璃化轉變溫度範圍的溫度在特定粘合點處策略性地軟化。只有在達到該臨界溫度閾值時，產品才可重新加工。在典型的 PCB 加工過程中，加工溫度不會降低 Structalit® 5751 的保護功能。它可以承受與回流焊接和額外的熱固化循環相關的溫度。

The current global shortage of chips and general electronic components in the automotive and consumer electronics sectors further highlights the significance of being able to reuse components.  Reuse of components is not only a benefit to the environment, it has become essential to sustain current production processes due to supply chain shortages.
 當前全球汽車和消費電子領域的晶片和通用電子元件短缺，進一步凸顯了能夠重複使用元件的重要性。組件的重複使用不僅對環境有益，而且由於供應鏈短缺，維持當前的生產過程變得至關重要。
 

https://www.panacol.com/press/press-releases